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Transient of thermal stresses in printed circuit boards

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dc.title Transient of thermal stresses in printed circuit boards en
dc.contributor.author Šuba, Oldřich
dc.contributor.author Sýkorová, Libuše
dc.relation.ispartof International Journal of Mechanics
dc.identifier.issn 1998-4448 OCLC, Ulrich, Sherpa/RoMEO, JCR
dc.date.issued 2011
utb.relation.volume 5
utb.relation.issue 3
dc.citation.spage 226
dc.citation.epage 233
dc.type article
dc.language.iso en
dc.relation.uri http://www.naun.org/multimedia/NAUN/mechanics/20-861.pdf
dc.subject Layered walls en
dc.subject Printed circuit boards en
dc.subject Thermal stress en
utb.faculty Faculty of Technology
dc.identifier.uri http://hdl.handle.net/10563/1002302
utb.identifier.rivid RIV/70883521:28110/11:43865257!RIV12-MSM-28110___
utb.identifier.obdid 43865259
utb.identifier.scopus 2-s2.0-79960054874
utb.source j-scopus
dc.date.accessioned 2011-09-30T00:09:47Z
dc.date.available 2011-09-30T00:09:47Z
utb.contributor.internalauthor Šuba, Oldřich
utb.contributor.internalauthor Sýkorová, Libuše
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