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Transient of thermal stresses in printed circuit boards

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ČSN ISO 690:2011 citation

Citace článku v časopise:
ŠUBA, Oldřich a Libuše SÝKOROVÁ. Transient of thermal stresses in printed circuit boards. International Journal of Mechanics [online]. 2011, vol. 5, iss. 3, s. 226-233. [cit. 2019-06-17]. ISSN 1998-4448. Dostupné z: http://www.naun.org/multimedia/NAUN/mechanics/20-861.pdf.

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