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Organovermiculite nanofillers in polypropylene

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dc.title Organovermiculite nanofillers in polypropylene en
dc.contributor.author Valášková, Marta
dc.contributor.author Simha-Martynková, Grażyna
dc.contributor.author Matějka, Vlastimil
dc.contributor.author Barabaszová, Karla
dc.contributor.author Plevová, Eva
dc.contributor.author Měřínská, Dagmar
dc.relation.ispartof Applied Clay Science
dc.identifier.issn 0169-1317 Scopus Sources, Sherpa/RoMEO, JCR
dc.date.issued 2009-01
utb.relation.volume 43
utb.relation.issue 1
dc.citation.spage 108
dc.citation.epage 112
dc.type article
dc.language.iso en
dc.publisher Elsevier Science B.V. en
dc.identifier.doi 10.1016/j.clay.2008.07.017
dc.relation.uri https://www.sciencedirect.com/science/article/pii/S016913170800152X
dc.subject Organovermiculite en
dc.subject Nanofiller en
dc.subject Exfoliation en
dc.subject X-ray powder diffraction en
dc.subject Jet milling en
dc.subject Thermal stability en
dc.description.abstract Vermiculite (VER) was exfoliated to be used as organovermiculite nanofiller(ODA/VER) for polypropylene (PP)/VER nanocomposites. We used three procedures. PI: low-temperature intercalation of melted octadecylamine (ODA) led to the regular bilayer arrangement of organic molecules in the interlayer space. P2: mechanical exfoliation of ODA/VER by jet milling decreased the crystallite size. P3: chemical exfoliation using an oxidizing agent potassium persulfate and subsequent intercalation with ODA created a mixture of monolayer and bilayer arrangements of organic cations in the interlayer. The thermal compounding of the organovermiculites (4 wt.%) with maleated PP at 30 and 50 rpm caused the partial deintercalation of the organovermiculite and organovermiculite pretreated with the oxidizing agent. The jet milled ODA/VER was very well dispersed within PP matrix. Thermal stability of PP and PP/VER nanocomposites with differently exfoliated ODA/VER nanofillers was evaluated by thermogravimetric analysis. (C) 2008 Elsevier B.V. All rights reserved. en
utb.faculty Faculty of Technology
dc.identifier.uri http://hdl.handle.net/10563/1002139
utb.identifier.obdid 43861550
utb.identifier.obdid 43864534
utb.identifier.scopus 2-s2.0-57649138848
utb.identifier.wok 000262658000017
utb.identifier.coden ACLSE
utb.source j-wok
dc.date.accessioned 2011-08-16T15:06:33Z
dc.date.available 2011-08-16T15:06:33Z
utb.contributor.internalauthor Měřínská, Dagmar
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