TBU Publications
Repository of TBU Publications

Surface layer micro-hardness of modified LDPE by radiation cross-linking after temperature load

DSpace Repository

Show simple item record

dc.title Surface layer micro-hardness of modified LDPE by radiation cross-linking after temperature load en
dc.contributor.author Mizera, Aleš
dc.contributor.author Maňas, Miroslav
dc.contributor.author Maňas, David
dc.contributor.author Ovsík, Martin
dc.contributor.author Hřibová, Martina
dc.contributor.author Staněk, Michal
dc.contributor.author Navrátil, Jan
dc.contributor.author Bednařík, Martin
dc.relation.ispartof Key Engineering Materials
dc.identifier.issn 1013-9826 OCLC, Ulrich, Sherpa/RoMEO, JCR
dc.identifier.isbn 978-3-03835-555-7
dc.date.issued 2015
utb.relation.volume 662
dc.citation.spage 177
dc.citation.epage 180
dc.event.title 11th International Conference on Local Mechanical Properties, LMP 2014
dc.event.location High Tatras
utb.event.state-en Slovakia
utb.event.state-cs Slovensko
dc.event.sdate 2014-11-12
dc.event.edate 2014-11-14
dc.type conferenceObject
dc.language.iso en
dc.publisher Trans Tech Publications Ltd.
dc.identifier.doi 10.4028/www.scientific.net/KEM.662.177
dc.relation.uri http://www.scientific.net/KEM.662.177
dc.subject Irradiation en
dc.subject Low density polyethylene (LDPE) en
dc.subject Micro-hardness en
dc.subject Radiation cross-linking en
dc.subject X-ray diffraction en
dc.description.abstract The presented article deals with the research of surface layer's micro-mechanical properties of modified LDPE by radiation cross-linking after temperature load. These micromechanical properties were measured by the DSI (Depth Sensing Indentation) method on samples which were non-irradiated and irradiated by different doses of the β - radiation and then were temperature loaded. The purpose of the article is to consider to what extent the irradiation process influences the resulting micro-mechanical properties measured by the DSI method. The LDPE tested showed significant changes of indentation hardness and modulus after temperature load. © (2015) Trans Tech Publications, Switzerland. en
utb.faculty Faculty of Applied Informatics
utb.faculty Faculty of Technology
dc.identifier.uri http://hdl.handle.net/10563/1005797
utb.identifier.obdid 43873990
utb.identifier.scopus 2-s2.0-84952342303
utb.identifier.coden KEMAE
utb.source d-scopus
dc.date.accessioned 2016-04-12T11:51:57Z
dc.date.available 2016-04-12T11:51:57Z
dc.description.sponsorship TA03010724, TA CR, Technologická Agentura České Republiky
utb.contributor.internalauthor Mizera, Aleš
utb.contributor.internalauthor Maňas, Miroslav
utb.contributor.internalauthor Maňas, David
utb.contributor.internalauthor Ovsík, Martin
utb.contributor.internalauthor Hřibová, Martina
utb.contributor.internalauthor Staněk, Michal
utb.contributor.internalauthor Navrátil, Jan
utb.contributor.internalauthor Bednařík, Martin
Find Full text

Files in this item

Show simple item record