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Characterization of SiC whisker-filled polybenzoxazine cured by microwave radiation and heat

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dc.title Characterization of SiC whisker-filled polybenzoxazine cured by microwave radiation and heat en
dc.contributor.author Rimdusit, Sarawut
dc.contributor.author Jiraprawatthagool, Varutrit
dc.contributor.author Tiptipakorn, Sunan
dc.contributor.author Covavisaruch, Sirijutaratana
dc.contributor.author Kitano, Takeshi
dc.relation.ispartof International Journal of Polymer Analysis and Characterization
dc.identifier.issn 1023-666X OCLC, Ulrich, Sherpa/RoMEO, JCR
dc.date.issued 2006
utb.relation.volume 11
utb.relation.issue 6
dc.citation.spage 441
dc.citation.epage 453
dc.type article
dc.language.iso en
dc.publisher Taylor and Francis Ltd. en
dc.identifier.doi 10.1080/10236660600983726
dc.relation.uri http://www.tandfonline.com/doi/abs/10.1080/10236660600983726
dc.subject composite en
dc.subject microwave processing en
dc.subject polybenzoxazine en
dc.subject silicon carbide whisker en
dc.description.abstract The effect of microwave and thermal curing on the properties of SiCw-filled polybenzoxazine is examined. The benzoxazine resin (BA-a) can be cured thermally above 150 degrees C but was hardly cured by microwave irradiation even using a power up to 1 kW. The presence of only 4% by weight of the SiCw significantly reduces the processing time of the composites from two hours at 200 degrees C using the traditional thermal cure to less than 20 minutes using a microwave cure power of 270W. The mechanical and thermal behaviors of the SiCw-filled polybenzoxazine show no significant difference with either curing methods. en
utb.faculty Faculty of Technology
dc.identifier.uri http://hdl.handle.net/10563/1002088
utb.identifier.obdid 43865419
utb.identifier.scopus 2-s2.0-33750867402
utb.identifier.wok 000241894700005
utb.source j-wok
dc.date.accessioned 2011-08-16T15:06:27Z
dc.date.available 2011-08-16T15:06:27Z
utb.contributor.internalauthor Kitano, Takeshi
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