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Separation of printed circuit board by temperature shock

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Citace článku v konferenčním sborníku:
JANÁČOVÁ, Dagmar, Karel KOLOMAZNÍK, Vladimír VAŠEK, Jiří KŘENEK a Michaela UHLÍŘOVÁ. Separation of printed circuit board by temperature shock. In: HTE'07: Proceedings of the 5th IASME / WSEAS International Conference on Heat Transfer, Thermal Engineering and Environment [online]. Vouliagmeni: World Scientific and Engineering Academy and Society (WSEAS), 2007, s. 267-270. [cit. 2019-12-16]. Dostupné z: http://www.wseas.us/e-library/conferences/2007athensmech/papers/565-254.pdf.

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