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Performance measurement of the D-class audio amplifier

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dc.title Performance measurement of the D-class audio amplifier en
dc.contributor.author Pospíšilík, Martin
dc.contributor.author Kasáček, Jiří
dc.contributor.author Mikuličová, Michaela
dc.contributor.author Adámek, Milan
dc.relation.ispartof Annals of DAAAM and Proceedings of the International DAAAM Symposium
dc.identifier.issn 1726-9679 Scopus Sources, Sherpa/RoMEO, JCR
dc.identifier.isbn 978-3-902734-20-4
dc.date.issued 2018
utb.relation.volume 29
utb.relation.issue 1
dc.citation.spage 267
dc.citation.epage 272
dc.event.title 29th International DAAAM Symposium on Intelligent Manufacturing and Automation, DAAAM 2018
dc.event.location Zadar
utb.event.state-en Croatia
utb.event.state-cs Chorvatsko
dc.event.sdate 2018-10-24
dc.event.edate 2018-10-27
dc.type conferenceObject
dc.language.iso en
dc.publisher Danube Adria Association for Automation and Manufacturing, DAAAM
dc.identifier.doi 10.2507/29th.daaam.proceedings.038
dc.relation.uri https://daaam.info/29th-proceedings-2018
dc.relation.uri https://www.daaam.info/Downloads/Pdfs/proceedings/proceedings_2018/038.pdf
dc.subject D-class en
dc.subject audio amplifier en
dc.subject power efficiency en
dc.subject power consumption en
dc.subject output power en
dc.description.abstract Class-D audio amplifiers seem to be a perspective way of development of electronics as they can obtain excellent power efficiency together with good performance characteristics. Moreover, they can be easily integrated on a single chip, resulting in clear, comprehensive and non-reckless construction of the audio amplifier. Because the power efficiency is considerably high, some designs even do not need any heat sink, since the heat dissipation can be fully provided by the chip package. In this paper a construction of such an amplifier, being based on the integrated circuit TPA3122, is described. This construction has been developed at Tomas Bata University in Zlin, using conventional component base. Moreover, the paper provides a comparison of the measured performance of the amplifier to the theoretical values provided by the manufacturer of the chip. © 2018, Danube Adria Association for Automation and Manufacturing, DAAAM. All rights reserved. en
utb.faculty Faculty of Applied Informatics
dc.identifier.uri http://hdl.handle.net/10563/1011231
utb.identifier.obdid 43878846
utb.identifier.scopus 2-s2.0-85060084468
utb.source d-scopus
dc.date.accessioned 2023-01-06T08:03:56Z
dc.date.available 2023-01-06T08:03:56Z
dc.description.sponsorship Ministerstvo Školství, Mládeže a Tělovýchovy, MŠMT: LO1303, MSMT-7778/2014; European Regional Development Fund, ERDF: CZ.1.05/2.1.00/03.0089
utb.contributor.internalauthor Pospíšilík, Martin
utb.contributor.internalauthor Mikuličová, Michaela
utb.contributor.internalauthor Adámek, Milan
utb.fulltext.affiliation Martin Pospisilik, Jiri Kasacek, Michaela Mikulicova, Milan Adamek
utb.fulltext.dates -
utb.fulltext.references [1] Infineon Technologies. (2005). Class D Audio Amplifier Basics. Online at: http://nf.duseknet.com/vykon.htm [2] Gaalaas, E. (2006). Class D Audio Amplifiers: What, Why, and How. Online at: http://www.analog.com/library/analogDialogue/archives/40-06/class_d.pdf [3] Texas Instruments. (2007). TPA 3122D2 datasheet. Online at: https://www.ti.com/lit/ds/symlink/tpa3122d2.pdf [4] Kotisa, Z. (2001). NF zesilovace 1. BEN Technicka literatura, ISBN 80-730-0030-X, Prague [5] Janku, P.; Pospisilik, M. & Dulik, T. (2016). Compact Step Down Voltage Converter Constructed in Terms of EMC, Proceedings of the 27th DAAAM International Symposium, pp.0514-0523, B. Katalinic (Ed.), Published by DAAAM International, ISBN 978-3-902734-08-2, ISSN 1726-9679, Vienna, Austria, DOI: 10.2507/27th.daaam.proceedings.077 [6] Marek, V[aclav] (2016). Basic Research of Thermal Transfer Simulations, Proceedings of the 27th DAAAM International Symposium, pp.0578-0585, B. Katalinic (Ed.), Published by DAAAM International, ISBN 978-3-902734-08-2, ISSN 1726-9679, Vienna, Austria, DOI: 10.2507/27th.daaam.proceedings.085 [7] Skocik, P[etr] & Korbel, J[iri] (2017). Assessment of Shielding Effectiveness and Percolation Threshold of Composite Materials, Proceedings of the 28th DAAAM International Symposium, pp.0054-0062, B. Katalinic (Ed.), Published by DAAAM International, ISBN 978-3-902734-11-2, ISSN 1726-9679, Vienna, Austria, DOI: 10.2507/28th.daaam.proceedings.007 [8] Matusu, R[adek]; Pekar, L[ibor] & Korbel, J[iri] (2017). Robust Stabilization of a Heating-Cooling System by Using Two Feedback Controllers: a Numerical-Graphical Analysis, Proceedings of the 28th DAAAM International Symposium, pp.0194-0198, B. Katalinic (Ed.), Published by DAAAM International, ISBN 978-3-902734-11-2, ISSN 1726-9679, Vienna, Austria, DOI: 10.2507/28th.daaam.proceedings.026
utb.fulltext.sponsorship This paper is supported by the Ministry of Education, Youth and Sports of the Czech Republic within the National Sustainability Programme project No. LO1303 (MSMT-7778/2014) and also by the European Regional Development Fund under the project CEBIA-Tech No. CZ.1.05/2.1.00/03.0089.
utb.fulltext.projects LO1303 (MSMT-7778/2014)
utb.fulltext.projects CZ.1.05/2.1.00/03.0089
utb.fulltext.faculty -
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