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Cross-Linking of Ethylene-Octene Copolymer (EOC) by Dicumyl Peroxide (DCP)

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dc.title Cross-Linking of Ethylene-Octene Copolymer (EOC) by Dicumyl Peroxide (DCP) en
dc.contributor.author Svoboda (FT), Petr
dc.contributor.author Poongavalappil, Sameepa
dc.contributor.author Theravalappil, Rajesh
dc.contributor.author Svobodová, Dagmar
dc.contributor.author Mokrejš, Pavel
dc.contributor.author Kolomazník, Karel
dc.contributor.author Ougizawa, Toshiaki
dc.contributor.author Inoue, Takashi
dc.relation.ispartof Journal of Applied Polymer Science
dc.identifier.issn 0021-8995 Scopus Sources, Sherpa/RoMEO, JCR
dc.date.issued 2011-07-05
utb.relation.volume 121
utb.relation.issue 1
dc.citation.spage 521
dc.citation.epage 530
dc.type article
dc.language.iso en
dc.publisher Wiley-Blackwell en
dc.identifier.doi 10.1002/app.33655
dc.relation.uri http://onlinelibrary.wiley.com/doi/10.1002/app.33655/abstract
dc.subject ethylene-octene copolymer en
dc.subject dicumyl peroxide en
dc.subject cross-linking en
dc.subject chain scission en
dc.subject RPA en
dc.subject DSC en
dc.description.abstract Ethylene-octene copolymer (EOC) was crosslinked by dicumyl peroxide (DCP) at various temperatures (150-200 degrees C). Six concentrations of DCP in range 0.2-0.7 wt % were investigated. cross-linking was studied by rubber process analyzer (RPA) and by differential scanning calorimetry (DSC). From RPA data analysis real part modulus s`, tan delta, and reaction rate were investigated as a function of peroxide content and temperature. The highest s`(max) and the lowest tan d were found for 0.7% of DCP at 150 degrees C. Chain scission was analyzed by slope analysis of conversion ratio, X in times after reaching the maximum. Less susceptible to chain scission are temperatures in range 150-170 degrees C and peroxide levels 0.2-0.5%. Heat of reaction was analyzed by DSC at various heating rates (5-40 degrees C min(-1)). It was found to be exothermic. By projection to zero heating rate, the reaction was found to start at 128 degrees C with the maximum at 168 degrees C. (c) 2011 Wiley Periodicals, Inc. J Appl Polym Sci 121: 521-530, 2011 en
utb.faculty Faculty of Technology
utb.faculty Faculty of Applied Informatics
utb.faculty Faculty of Humanities
dc.identifier.uri http://hdl.handle.net/10563/1002177
utb.identifier.rivid RIV/70883521:28110/11:43865339!RIV12-MSM-28110___
utb.identifier.rivid RIV/70883521:28140/11:43865339!RIV12-MSM-28140___
utb.identifier.rivid RIV/70883521:28150/11:43865339!RIV12-MSM-28150___
utb.identifier.obdid 43865341
utb.identifier.scopus 2-s2.0-79953683397
utb.identifier.wok 000289353700063
utb.identifier.coden JAPNA
utb.source j-wok
dc.date.accessioned 2011-08-16T15:06:37Z
dc.date.available 2011-08-16T15:06:37Z
utb.contributor.internalauthor Svoboda (FT), Petr
utb.contributor.internalauthor Poongavalappil, Sameepa
utb.contributor.internalauthor Theravalappil, Rajesh
utb.contributor.internalauthor Svobodová, Dagmar
utb.contributor.internalauthor Mokrejš, Pavel
utb.contributor.internalauthor Kolomazník, Karel
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