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PEDOT: PSS temperature sensor ink-jet printed on paper substrate

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dc.title PEDOT: PSS temperature sensor ink-jet printed on paper substrate en
dc.contributor.author Mašlík, Jan
dc.contributor.author Andersson, Henrik
dc.contributor.author Forsberg, Viviane
dc.contributor.author Engholm, Magnus
dc.contributor.author Zhang, Renyun
dc.contributor.author Olin, Håkan
dc.relation.ispartof Journal of Instrumentation
dc.identifier.issn 1748-0221 Scopus Sources, Sherpa/RoMEO, JCR
dc.date.issued 2018
utb.relation.volume 13
dc.type article
dc.type conferenceObject
dc.language.iso en
dc.publisher IOP Publishing, Ltd.
dc.identifier.doi 10.1088/1748-0221/13/12/C12010
dc.relation.uri http://iopscience.iop.org/article/10.1088/1748-0221/13/12/C12010/meta
dc.subject Detector design and construction technologies and materials en
dc.subject Manufacturing en
dc.description.abstract In this work we present an ink-jet printed temperature sensor consisting of PEDOT:PSS printed on paper suitable for packaging, flexible electronics and other printed applications. The substrate showed to have a large influence on both the resistance as well as the temperature sensitivity of the PEDOT: PSS ink. This effect is most likely due to NaCl content in the photo paper coating, which reacts with the PEDOT: PSS. The temperature coefficient of a prepared device of alpha = -0.030 relative to room temperature (22 degrees C) was measured, which is higher than compared to for example Silicon alpha = -0.075. en
utb.faculty University Institute
dc.identifier.uri http://hdl.handle.net/10563/1008418
utb.identifier.obdid 43879317
utb.identifier.scopus 2-s2.0-85059901876
utb.identifier.wok 000452801600005
utb.source j-wok
dc.date.accessioned 2019-01-31T08:59:00Z
dc.date.available 2019-01-31T08:59:00Z
dc.description.sponsorship EU Regional Fund; Swedish KK Foundation; Ministry of Education, Youth and Sports of the Czech Republic-Program NPU I [LO1504]
utb.ou Centre of Polymer Systems
utb.contributor.internalauthor Mašlík, Jan
utb.fulltext.affiliation J. Maslik a,b, H. Andersson a,1, V. Forsberg a, M. Engholm a, R. Zhang a, H. Olin a a Mid Sweden University, Electronics Design Division, SE-851 70, Sundsvall, Sweden b Centre of Polymer Systems, University Institute, Tomas Bata University in Zlin, trida Tomase Bati 5678, 760 01 Zlin, Czech Republic E-mail: henrik.andersson@miun.se
utb.fulltext.dates Received: October 14, 2018 Accepted: November 16, 2018 Published: December 11, 2018
utb.wos.affiliation [Maslik, J.; Andersson, H.; Forsberg, V; Engholm, M.; Zhang, R.; Olin, H.] Mid Sweden Univ, Elect Design Div, SE-85170 Sundsvall, Sweden; [Maslik, J.] Tomas Bata Univ Zlin, Univ Inst, Ctr Polymer Syst, Trida Tomase Bati 5678, Zlin 76001, Czech Republic
utb.scopus.affiliation Maslik J., Mid Sweden University, Electronics Design Division, Sundsvall, SE-851 70, Sweden, Centre of Polymer Systems, University Institute, Tomas Bata University in Zlin, trida Tomase Bati 5678, Zlin, 760 01, Czech Republic; Andersson H., Mid Sweden University, Electronics Design Division, Sundsvall, SE-851 70, Sweden; Forsberg V., Mid Sweden University, Electronics Design Division, Sundsvall, SE-851 70, Sweden; Engholm M., Mid Sweden University, Electronics Design Division, Sundsvall, SE-851 70, Sweden; Zhang R., Mid Sweden University, Electronics Design Division, Sundsvall, SE-851 70, Sweden; Olin H., Mid Sweden University, Electronics Design Division, Sundsvall, SE-851 70, Sweden
utb.fulltext.faculty University Institute
utb.fulltext.ou Centre of Polymer Systems
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