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Curing behavior and reaction kinetics of binder resins for 3D-printing investigated by dielectric analysis (DEA)

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Citace článku v konferenčním sborníku:
MÖGINGER, Bernhard, L. KEHRET, Berenika HAUSNEROVÁ a Johannes STEINHAUS. Curing behavior and reaction kinetics of binder resins for 3D-printing investigated by dielectric analysis (DEA). In: AIP Conference Proceedings [online]. Naples: American Institute of Physics (AIP), 2016 [cit. 2019-07-17]. ISSN 0094-243X. Dostupné z: http://aip.scitation.org/doi/abs/10.1063/1.4949649.

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